{"id":2075,"date":"2026-06-10T16:22:34","date_gmt":"2026-06-10T14:22:34","guid":{"rendered":"https:\/\/biegema.preview.jetzt\/fertigungsbeispiele\/clip-on-heat-sink-finger-style-heat-sink-for-transistors\/"},"modified":"2026-06-10T16:22:34","modified_gmt":"2026-06-10T14:22:34","slug":"clip-on-heat-sink-finger-style-heat-sink-for-transistors","status":"publish","type":"bauteile","link":"https:\/\/biegema.de\/en\/manufacturing-examples\/clip-on-heat-sink-finger-style-heat-sink-for-transistors\/","title":{"rendered":"Clip-on heat sink \/ finger-style heat sink for transistors"},"excerpt":{"rendered":"<p>Clip-on heat sink as a stamped and formed part for transistor packages (e.g. TO-220): the heat sink slides onto the component, the integrated retaining clip secures it mechanically and ensures thermal contact. The protruding cooling fingers maximize surface area per volume and dissipate low to medium power losses directly on the printed circuit board.<\/p>\n","protected":false},"featured_media":412,"template":"","class_list":["post-2075","bauteile","type-bauteile","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/biegema.de\/en\/wp-json\/wp\/v2\/bauteile\/2075","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/biegema.de\/en\/wp-json\/wp\/v2\/bauteile"}],"about":[{"href":"https:\/\/biegema.de\/en\/wp-json\/wp\/v2\/types\/bauteile"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/biegema.de\/en\/wp-json\/wp\/v2\/media\/412"}],"wp:attachment":[{"href":"https:\/\/biegema.de\/en\/wp-json\/wp\/v2\/media?parent=2075"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}